Silicone-free high-performance thermal conductive material * Thermal design column and comparison test data available.
Adopted by the supercomputer "Fugaku"! Reducing electrical contact failures! Introducing a silicone-free, high-performance thermal interface material that does not generate low molecular weight siloxanes!
"Cosmo Thermal Grease" and "Cosmo Thermal Gap Filler" are high-performance thermal materials with excellent heat resistance and high thermal conductivity. Since they do not use silicone-based materials, there is no concern about contact failure due to low molecular siloxane. Please choose between grease and gap filler (hardened type) according to your application. "Cosmo Thermal Grease" is a non-silicone thermal material that can be spread thinly up to several tens of micrometers, reducing thermal resistance. It is used in many fields, including computer CPUs, wireless base stations, office multifunction devices, car navigation systems, and home appliances. "Cosmo Thermal Gap Filler" is a hardened thermal paste. It can be controlled to any thickness, resulting in less stress on components. You can choose between a one-component heat-curing type and a two-component room-temperature curing type. ★ You can download test data comparing thermal effects. ★ You can also download the "Thermal Design Column" written by Naoki Kunimine, the representative director of Thermal Design Lab. *For more details, please refer to the PDF materials or feel free to contact us.
- Company：コスモ石油ルブリカンツ
- Price：Other
